印制电路板行业翻译公司-PCB行业英文常用词汇翻译-上海译境整理
发表时间：2015/05/30 00:00:00 来源：www.e-ging.com 作者：www.e-ging.com 浏览次数：7796
| PCB常用英文词汇汇编 | |||||||||
| A a | |||||||||
| A.O.I(Automatic Optical Inspection) | 自动光学检查 | Apparatus | 设备，仪器 | ||||||
| Acceptable quality level (AQL) | 可接受质量水平 | Area | 面积 | ||||||
| Accuracy | 精确度 | Artwork | 菲林 | ||||||
| Activating | 活化 | Artwork Drawing | 菲林图形 | ||||||
| Active carbon treatment | 活性碳处理 | Artwork Film | 原装菲林 | ||||||
| After Pressed Thickness | 压板后之厚度 | Artwork Modification | 菲林修改 | ||||||
| Alignment | 校直，结盟 | Artwork No. | 菲林编号 | ||||||
| Annular ring | 锡圈 | Assembly | 组装，装配 | ||||||
| Anti-Static Bag | 静电胶袋 | Axis | 轴 | ||||||
| B b | |||||||||
| Backplane | 背板 | Blistering | 起泡/水泡 | ||||||
| Back-up | 垫板 | Board Cutting | 开料 | ||||||
| Baking | 烘板 | Board Thickness | 板厚 | ||||||
| Ball Grid Array (BGA) | 球栅阵列 | Bottom side | 底层 | ||||||
| Bare board | 裸板 | Breakaway tab | 打断点 | ||||||
| Base Copper | 底铜 | Brushing | 磨刷 | ||||||
| Base material | 基材 | Build-up | 积层 | ||||||
| Bevelling | 斜边 | Bullet pad | 子弹盘 | ||||||
| Black Oxide | 黑氧化 | Buried hole | 埋孔 | ||||||
| Blind via hole | 盲孔 | ||||||||
| C c | |||||||||
| C/M(Component Marking) | 元件字符 | Conductor width/space | 导体线宽/线隙 | ||||||
| Carbon ink | 碳油 | Contact | 接点 | ||||||
| Carrier | 带板 | Copper area | 铜面积 | ||||||
| Ceramic substrate | 陶瓷 | Copper clad | 铜箔 | ||||||
| Certificate of Compliance | 合格证书 | Copper foil | 铜箔 | ||||||
| Chamfer | 倒角 | Copper plating | 电镀铜 | ||||||
| Chemical cleaning | 化学清洗 | Corner | 角线 | ||||||
| Chemical corrosion | 化学腐蚀 | Corner mark | 板角记号 | ||||||
| Chip Scale Package (CSP) | 晶片比例包装 | Corner REG.Hole | 角位对位孔 | ||||||
| Circuit | 线路 | Cracking | 裂缝 | ||||||
| Clearance | 间距/间隙 | Creasing | 皱折 | ||||||
| Color | 颜色 | Criteria | 规格,标准 | ||||||
| Component Side(C/S) | 元件面 | Crossection area | 切面 | ||||||
| Composite layers | 复合层 | Cu/Sn Plating | 镀铜锡 | ||||||
| Computer Aided Design (CAD) | 电脑辅助设计 | Current efficiency | 电流效率 | ||||||
| Computer Aided Manufacturing (CAM) | 电脑辅助制作 | Customer | 客户 | ||||||
| Computer Numerial Control (CNC) | 数控 | Customer Drilling File | 客户钻孔资料 | ||||||
| Conductor | 导体 | Customer P/N | 客户产品编号 | ||||||
| D d | |||||||||
| D/F Registration Hole | 干菲林对位孔 | Diamond | 钻石 | ||||||
| D/F(Dry Film) | 干膜 | Diazo film | 重氮片 | ||||||
| Date Code | 日期代号 | Dielectric breakdown | 介电击穿 | ||||||
| Datum hole | 基准参考孔 | Dielectric constant | 介电常数 | ||||||
| Daughter board | 子板 | Dielectric Thickness | 介电层厚度 | ||||||
| Deburring | 去毛刺 | Dielectric Voltage Test | 绝缘测试 | ||||||
| Defect | 缺陷 | Dimension | 尺寸 | ||||||
| Definition | 定义 | Dimensional stability | 尺寸稳定性 | ||||||
| Delamination | 分层 | Direct/indirect | 直接/间接 | ||||||
| Delay | 耽搁 | Distribution | 发放 | ||||||
| Delivery | 交货 | Document type | 文件种类 | ||||||
| Densitomefer | 透光度计 | Documentation Control | 文件控制 | ||||||
| Density | 密度 | Double sided board | 双面板 | ||||||
| Department | 部门 | Drill bit | 钻咀 | ||||||
| Description | 说明 | Drilling | 钻孔 | ||||||
| Design origin | 设计原点 | Drilling Roughness | 钻孔粗糙度 | ||||||
| Desmear | 去钻污,除胶 | Dry Film | 干菲林 | ||||||
| Dessicant | 防潮珠 | Dry Film-Pattern | 干膜线路 | ||||||
| Developer | 显影液,显影机 | Dynamic | 动态 | ||||||
| E e | |||||||||
| ECN(Engineering Change Notification) | 工程更改通知 | Entek | 有机涂覆 | ||||||
| Effective date | 有效期 | Epoxy glass substrate | 环氧玻璃基板 | ||||||
| Electrical Test Fixture | 电测试 针床 | Epoxy resin | 环氧基树脂 | ||||||
| Electro migration | 漏电 | Etch | 蚀刻 | ||||||
| Electroconductive paste | 导电胶 | Etchback | 凹蚀 | ||||||
| Electroless | 无电沉 | Etching | 蚀刻 | ||||||
| Electroless copper | 无电沉铜 | E-Test Marking | 电测试标记 | ||||||
| Electroless Ni | 无电沉镍 | E-Test(Electrical Test) | 电测试 | ||||||
| Electroless Gold/Au | 无电沉金 | Exposure | 曝光 | ||||||
| Engineering drawing | 工程图纸 | External layer | 外层 | ||||||
| F f | |||||||||
| Fiducial mark | 基准点 | Fixture | 夹具 | ||||||
| Filling | 填充 | Flammability | 可燃性 | ||||||
| Film Fabrication | 菲林制作 | Flash Gold | 薄金 | ||||||
| Final QC | 最终检查 | Flexible | 易曲的,能变形的 | ||||||
| Finish Overall Board Thickness | 成品总板厚度 | Flux | 助焊剂 | ||||||
| G g | |||||||||
| General information | 一般资料 | Golden board | 金板 | ||||||
| Ghost image | 重影 | Grid | 网格 | ||||||
| Glass transition temperature | 玻璃化湿度 | Ground plane | 地线层 | ||||||
| Gold Finger(G/F) | 金手指 | ||||||||
| H h | |||||||||
| HAL(Hot Air Leveling) | 热风整平 | Hole density | 孔的密度 | ||||||
| Hand Rout | 手锣 | Hole Diameter | 孔径 | ||||||
| Hardness | 硬度 | Hole location | 孔位 | ||||||
| Heat Sealed | 热密封 | Hole Location Chart | 孔位座标表 | ||||||
| Heat Shrink-warp | 热收缩 | Hole Position Tolerance | 孔位误差 | ||||||
| Holding time | 停留时间 | Hole size | 孔尺寸 | ||||||
| Hole | 孔 | Hot Air Leveling(HAL) | 热风整平 | ||||||
| Hole breakout | 破环 | Humidity | 湿度 | ||||||
| I | |||||||||
| Identification | 标识,指标 | Inter Plane Separation | 内层分离 | ||||||
| Image | 影像 | Interleave Paper | 隔纸 | ||||||
| Imaging transfer | 图形转移 | Internal layer | 内层 | ||||||
| Impedance | 阻抗 | Internal stress | 内应力 | ||||||
| Impedance Test | 阻抗测试 | Ionic cleanliness | 离子清洁度 | ||||||
| Inner copper foil | 内层铜箔 | Isolation | 孤立 | ||||||
| Inspection | 检验 | Isolation Resistance | 绝缘电阻 | ||||||
| Insulation resistance Test | 绝缘测试 | Item | 项目 | ||||||
| K k | |||||||||
| KEY board | 按键盘 | Kraft paper | 牛皮纸 | ||||||
| Key slot | 槽孔 | ||||||||
| L l | |||||||||
| Laminate | 板材 | Legend Width | 字符宽度 | ||||||
| Laminate Thickness | 材料厚度 | Length | 长度 | ||||||
| Lamination void | 层间空洞 | Lifted Lands | 残铜 | ||||||
| Landless hole | 破孔 | Line Width | 线宽 | ||||||
| Laser plotter | 激光绘图机 | Liquid | 液体 | ||||||
| Laser plotting | 激光绘图 | Location | 位置 | ||||||
| Laser via hole | 激光穿孔 | Logic diagram | 逻辑图形 | ||||||
| Layup | 层压配本 | Logo | 唛头,标记 | ||||||
| Lay-up Instruction | 压板指示 | Lot size | 批卡 | ||||||
| Legend | 字符 | ||||||||
| M m | |||||||||
| Mark | 标记 | Min. Nickel Thickness | 最小镍厚 | ||||||
| Master drawing | 菲林图形 | Min. Tin-Lead Thickness (After HAL) | （喷锡后）最小锡厚 | ||||||
| Material Thickness | 材料厚度 | Min.Annular Ring | 最小环宽 | ||||||
| Material Type | 材料类型 | Min.Spacing between Line to Line | 线与线之间的最小距离 | ||||||
| Max. X-out | 坏板上限 | Min.Spacing between Line to Pad | 线与焊盘之间的最小距离 | ||||||
| Max.Board Thickness After Plating | 电镀后总板厚度之上限 | Min.Spacing between Pad to Pad | 焊盘与焊盘之间的最小距离 | ||||||
| Measling | 白斑 | Minimum | 最小 | ||||||
| Mech Drawing No. | 图纸编号 | Mirroring | 镜像 | ||||||
| Mechanical cleaning | 机械清洗 | Missing | 缺少 | ||||||
| Metal | 金属 | Model No. | 产品名称 | ||||||
| Method | 方法 | Molded | 模塑 | ||||||
| MI(Manufacturing Instruction) | 生产制作指示 | Mother board | 主板 | ||||||
| Microstrip | 微条线 | Moulding | 模房 | ||||||
| Min Conductor Copper Thickness | 最小线路铜厚 | Mounting hole | 安装孔 | ||||||
| Min Hole Wall Copper Thickness | 最小孔壁铜厚 | Multilayer | 多层板 | ||||||
| Min. Gold Plating Thickness | 最小金厚 | Multi-layer Laminate | 多层板材料 | ||||||
| N n | |||||||||
| Negative | 反面的 | No.of Panel per Stack | 每叠板数 | ||||||
| Net list | 网络表 | No.of Panel/Sheet | 每张大料拼板数 | ||||||
| Network | 网络 | No.of Pcs Per Bag | 每包数量 | ||||||
| Nick | 缺口 | No.of Unit/Array | 每套单元数 | ||||||
| No. of holes | 孔数 | Normal value | 标准值 | ||||||
| No.of Array/Panel | 每个拼板套板数 | ||||||||
| O o | |||||||||
| Oblong | 椭圆形的 | Organic Solerability Peservatives(OSP) | 有机保护剂 | ||||||
| Offset | 偏移 | Originator | 原作者 | ||||||
| Open/short | 开路/短路 | Outer copper foil | 外层铜箔 | ||||||
| Optimization(design) | 最佳化(设计) | Outline | 外形 | ||||||
| P p | |||||||||
| Packing | 包装 | Pitch | 间距 | ||||||
| Packing | 包装 | Placement | 放置 | ||||||
| Pad | 焊盘 | Plated Though Hole(PTH) | 沉铜 | ||||||
| Panel Area | 拼板面积 | Plating | 电镀 | ||||||
| Panel Plated Crack | 板镀缺口 | Plating Crack | 电镀裂缝 | ||||||
| Panel plating | 整板电镀 | Plating line | 电镀线 | ||||||
| Panel Size | 拼板尺寸 | Plating rack | 电镀架 | ||||||
| Panel Size After Outerlayer Cutting | 外层切板后拼板尺寸 | Plating Void | 电镀针孔 | ||||||
| Panel Utilization | 拼板利用率 | Plug Hole | 塞孔 | ||||||
| Pass rate | 通过率 | Polymer | 聚合体 | ||||||
| Passivation | 钝化 | Porosity | 孔隙率 | ||||||
| Pattern | 线路 | Positive | 绝对的 | ||||||
| Pattern Inspection | 线路检查 | Power plane | 电源层 | ||||||
| Pattern plating | 图形电镀 | Prepreg | 半固化片 | ||||||
| PCB(Printed Circuit Board) | 印制线路板 | Primary side | 首面 | ||||||
| Peck drilling | 啄钻 | 印刷 | |||||||
| Peel strength | 剥离强度 | Probe point | 针床测点 | ||||||
| Peelable | 可剥性 | Process | 工序 | ||||||
| Peelable | 剥离强度 | Process flow | 工序流程 | ||||||
| Peelable Mask | 可脱油 | Product Planning Dept. | 生产计划部 | ||||||
| Peeling | 剥离 | Production | 生产板 | ||||||
| Permanent | 永久性 | Profile | 外形 | ||||||
| PH value | PH值 | Profiling | 外形加工 | ||||||
| Photo plotting | 图形输出 | Profiling Process | 外形加工 | ||||||
| Photo via hole | 菲林过孔 | Project No. | 产品编号 | ||||||
| Photographers | 照片靶标 | PTH Thermal Seress Test | PTH热冲击测试 | ||||||
| Photoplotler | 光绘机 | PTH(Plating Through Hole) | 沉铜 | ||||||
| Physical | 物理的 | Pull away | 拉离 | ||||||
| Pin hole | 销定孔 | Punch | 啤模 | ||||||
| Pink ring | 粉红环 | Punching | 冲切 | ||||||
| Pinning hole | 钻孔管位 | Punching Mould Drawing | 啤模图形 | ||||||
| Q q | |||||||||
| QA Audit | 品质审计 | Quality | 质量 | ||||||
| QA(Quanlity Assurance) | 品质部 | Quantity | 数量 | ||||||
| Quad Palt Pack (QFP) | 四边扁平林整器件 | ||||||||
| R r | |||||||||
| Raw Material Utilization | 原材料利用率 | Resist | 抗蚀剂 | ||||||
| Recall | 回收 | Resolution | 分辨率 | ||||||
| Rectifier | 整流器 | Rigid | 精密的 | ||||||
| Register mark | 对位点 | Roller coating | 涂覆 | ||||||
| Registration | 重合点 | Roughening | 粗化 | ||||||
| Remark | 备注 | Round pad | 圆盘 | ||||||
| Resin | 树脂 | Routing | 外形加工,铣板 | ||||||
| Resin Recession | 流胶 | ||||||||
| S s | |||||||||
| S/M Material | 绿油物料 | Solder mask on bare copper (smobc) | 裸铜覆盖阻焊膜 | ||||||
| S/M(Solder Mask) | 阻焊 | Solder side | 焊接面 | ||||||
| Sales | 销售 | Solder Side C/M | 阻焊面字符 | ||||||
| Sample | 样板 | Solder Side Cir. | 焊接面线路 | ||||||
| Sampling inspection | 抽样检验 | Solder Side Circuit | 焊接面 | ||||||
| Scaling factor | 缩放比例因素 | Solder Side S/M | 焊接面阻焊 | ||||||
| Scope | 范围 | Solderability | 可焊性 | ||||||
| Scoring | 刻槽 | Solvent Test | 可溶性测试 | ||||||
| Scratch | 划痕 | Spacing | 线距 | ||||||
| Secondary side | 第二面 | Special requirement | 特殊要求 | ||||||
| Section Code | 组别代号 | Specification | 详细说明，规范 | ||||||
| Section Code Change | 组别代号更改 | Spindle | 主轴 | ||||||
| Segment | 部分,片段 | Split | 裂片 | ||||||
| Separated | 分离 | Square pad | 方块 | ||||||
| Sequence | 顺序 | Standard | 标准值 | ||||||
| Sets | 套 | Static | 静态 | ||||||
| Sheet Size | 大料尺寸 | Stencial | 网版 | ||||||
| Shematic diagram | 原理图 | Step drilling | 分布钻 | ||||||
| Shiny | 有光泽的,发光的 | Step scale | 光梯尺 | ||||||
| Silk screen | 丝印 | Store | 货仓 | ||||||
| Silver film | 银盐片 | Supplier | 供应商 | ||||||
| Single/double | 单层/双面 | Supported hole | 支撑点 | ||||||
| Slot | 槽,坑 | Surface | 表面 | ||||||
| Smear | 污点 | Surface mount technology | 表面组装技术 | ||||||
| Solder Mask | 阻焊 | Swimming | 滑移 | ||||||
| T t | |||||||||
| Tack | 堆起 | Thermal stress | 热应力 | ||||||
| Tape Programming | 铬带制作 | Thickness | 厚度 | ||||||
| Tape Test | 胶带测试 | Tin Content | 锡含量 | ||||||
| Target Hole | 目标孔 | Tin/Lead Stripping | 退铅锡 | ||||||
| Teardrop | 泪珠 | Tin-lead plating | 电镀铅锡 | ||||||
| Template | 天平 | Tolerance | 公差 | ||||||
| Tenting | 封孔 | Top side | 板面 | ||||||
| Test | 测试 | Touch up | 修理(执漏) | ||||||
| Test coupon | 图样 | Training | 训练 | ||||||
| Test Parameter | 测试参数 | Transmission | 传输线 | ||||||
| Test Pattern | 测试孔 | Transmittance | 传送 | ||||||
| Testing Voltage | 电压 | Trim line | 修剪 | ||||||
| Thermal shock | 热冲击 | ||||||||
| U u | |||||||||
| Ultrasonic cleaning | 超声波清洗 | Unit Layout Per Panel | 单元拼板图 | ||||||
| Undercut | 侧蚀 | Uv-blocking | 阻挡紫外线 | ||||||
| Unit Arrangement | 单元排版 | ||||||||
| V v | |||||||||
| Vacunm Pack | 真空包装 | Visual & Warpage | 可视性和翘曲度 | ||||||
| Vacuum lamination | 真空压制 | Visual inspection | 目检 | ||||||
| V-Cut | V- 坑 | Voltage | 电压 | ||||||
| View From… | 观察方向由… | ||||||||
| W w | |||||||||
| W/F(Wet Film) | 湿膜 | Width | 宽度 | ||||||
| Warp & Twist | 翘曲和弯曲 | Wiring | 线路 | ||||||
